EV Group Unleashes Next-Gen Laser and Plasma Technologies to Revolutionize Advanced Packaging at SEMICON Taiwan 2025

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, is set to captivate the semiconductor world at SEMICON Taiwan 2025. The company will unveil its groundbreaking laser and plasma processing technologies, poised to revolutionize advanced packaging and drive the next era of electronic innovation.

As the demand for more powerful, efficient, and compact electronic devices continues to surge – fueling advancements in AI, high-performance computing, autonomous vehicles, and smartphones – the importance of advanced packaging has never been greater.

EVG's innovations are specifically designed to tackle the intricate challenges and unlock the immense potential within critical trends like heterogeneous integration, high-bandwidth memory (HBM), and sophisticated chiplet-based designs.

Central to EVG's showcase are its pioneering laser processing solutions.

The EVG® LITHOGLAS® platform represents a significant leap forward in laser processing for glass substrates. Glass, with its superior electrical and thermal properties, is emerging as an ideal material for advanced packaging, enabling higher-density interconnects and large-area fan-out packages. LITHOGLAS allows for ultra-precise patterning and processing on these delicate yet promising materials, paving the way for revolutionary package architectures.

Further enhancing its laser portfolio, EVG will feature its advanced EVG® LITHOS® laser debonding solutions.

These systems are indispensable for handling the increasingly thin and often warpage-prone wafers essential for 3D-IC and HBM manufacturing. LITHOS ensures damage-free separation of carrier and device wafers, a critical step for maintaining device integrity, maximizing yield, and enabling the fabrication of ultra-thin device layers without compromising performance.

Adding another layer of innovation is the EVG® MLE™ (Maskless Exposure) technology.

This flexible, high-resolution lithography solution is perfectly suited for the dynamic requirements of advanced packaging. It offers rapid prototyping capabilities, supports highly customized designs, and enables precise patterning on a diverse array of substrates, eliminating the need for expensive, rigid photomasks and accelerating development cycles.

Beyond laser capabilities, EVG will also spotlight its extensive expertise in low-temperature plasma processing.

These solutions are fundamental for addressing critical manufacturing steps such as plasma dicing and advanced plasma cleaning. Plasma dicing, a gentler alternative to mechanical dicing, significantly reduces chipping and improves yield for ultra-thin dies, which are crucial for advanced packaging. Meanwhile, plasma cleaning and surface activation processes are vital for improving adhesion, reducing contamination, and preparing surfaces for subsequent high-precision bonding or deposition steps, all while minimizing thermal stress on sensitive device structures.

Collectively, these cutting-edge technologies empower the semiconductor industry to surmount traditional manufacturing barriers, facilitating the creation of higher-performing, more compact, and exceptionally cost-effective electronic systems.

EVG's solutions are engineered to boost throughput, achieve superior yields, and reduce the overall cost of ownership, driving the next wave of semiconductor innovation across various applications.

EVG's presence at SEMICON Taiwan not only highlights their technological prowess but also underscores their strong commitment to collaborative innovation within the global advanced packaging ecosystem.

By working closely with industry leaders and research institutions, EVG ensures its solutions meet the evolving and often stringent demands of the semiconductor roadmap, particularly supporting Asia's pivotal role in the global electronics supply chain.

Attendees of SEMICON Taiwan 2025 are cordially invited to visit EV Group at the Nangang Exhibition Center, Hall 1, 1F, Booth J3216.

This will be an unparalleled opportunity to engage with EVG's experts, witness live demonstrations, and delve deeper into how these transformative laser and plasma technologies are shaping the future of advanced packaging.