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Samsung Secures $200 Billion Deal to Fuel Broadcom’s Next‑Gen AI Chips
Taiwan’s NTHU Chooses Next‑Gen MBX Lithography Platform to Accelerate Chip Prototyping
Paras Defence & Space Technologies Rolls Out a Rs 6,200 Crore Semiconductor Packaging Plant – Shares Slip Slightly
India’s Next Chip Drive: Semicon 2.0 Calls for More CMOS, Memory, Display and Advanced‑Packaging Plants
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