ER Unveils Future of Advanced Packaging with Cutting-Edge Laser & Plasma Tech at SEMICON Taiwan 2025

The future of semiconductor manufacturing is rapidly evolving, demanding unprecedented levels of precision, integration, and efficiency. At the forefront of this revolution, ER, a pioneer in advanced processing solutions, is poised to unveil its latest breakthroughs at SEMICON Taiwan 2025. Attendees will witness firsthand how ER’s cutting-edge laser and plasma technologies are not just meeting industry demands but actively shaping the landscape of advanced packaging.

As the semiconductor industry grapples with the complexities of chiplet integration, high-density interconnections, and the burgeoning 3D IC era, conventional manufacturing methods often fall short.

ER's comprehensive portfolio of laser microfabrication (LMF) and plasma solutions is specifically engineered to tackle these critical challenges, providing the robust, scalable, and cost-effective tools necessary for the next generation of high-performance devices.

Unlocking Precision with Laser Technologies:

• Laser Microfabrication (LMF): This core technology delivers ultra-precise cutting, drilling, and shaping capabilities, essential for wafer-level packaging and advanced substrate processing.

  Its fine resolution ensures minimal material loss and superior structural integrity.

• Laser Annealing: By precisely heating and cooling materials, laser annealing enhances their intrinsic properties, significantly reducing stress in thin films and improving overall device reliability and performance.
• Laser Lift-Off (LLO): A game-changer for heterogeneous integration, LLO enables the delicate transfer of ultra-thin dies, paving the way for more compact and powerful multi-chip modules.
• Laser Grooving/Dicing: Achieving clean, damage-free die separation is paramount.

  ER’s laser grooving and dicing solutions offer superior precision compared to traditional methods, minimizing yield loss.

• Laser Decapsulation: Crucial for quality control and failure analysis, this technology allows for the precise removal of encapsulation materials without damaging the sensitive internal components of a device.

Transforming Surfaces with Plasma Innovations:

• Plasma Ashing/Desmear: This powerful cleaning process effectively removes organic residues and desmear from surfaces, guaranteeing optimal adhesion and reliability for subsequent bonding steps.
• Plasma Etching: Essential for creating fine-feature patterns and precise material removal, ER’s plasma etching solutions enable the intricate designs required for advanced interconnects and device architectures.
• Plasma Cleaning/Activation: By meticulously preparing surfaces, these processes enhance bonding strength, improve electrical contact, and significantly boost the overall long-term reliability of packaged devices.

Together, ER’s integrated laser and plasma solutions represent a synergistic approach to advanced packaging.

They promise not only high precision and throughput but also crucial benefits like low damage, enhanced cost-effectiveness, and critical scalability for mass production. These technologies are instrumental in enabling the integration of diverse functionalities into smaller, more powerful, and energy-efficient packages.

Semiconductor professionals, engineers, and industry leaders are cordially invited to visit ER's booth at SEMICON Taiwan 2025 to experience these groundbreaking technologies firsthand.

Discover how ER is empowering manufacturers to overcome the most formidable challenges in advanced packaging, paving the way for the next generation of electronics that will power our connected world.